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Standard planar manufacturing of photonic
packages |
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Single chip integration of multiple
functions - transmitter, receivers and
built-in-test |
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High speed digital (10 Gbps) or RF photonic
components |
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Ability to optically monitor Vertical Cavity
Surface Emitter Lasers (VCSEL) on a per-channel
basis |
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Operation over a wide temperature range and
radiation |
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Integrated Built-In-Test for In-Line
Measurement of the following: |
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* Optical Time Domain Reflectometry - isolate
location of fiber faults to 1 cm
* Optical power level measurements
* Loss of signal on transmit & receive channels -
programmable threshold
* Laser characteristics - insitu operating
conditions
* Bit Errors and Channel Bandwidth (via eye
diagram measurements) |