We supply highly compact and robust photonic components
for harsh environment applications, such as satellites,
military airframe, UAV, missiles and cell phone base
station applications.
We have developed a hybrid IC and optoelectronic
integration approach that features:
Standard planar manufacturing of photonic
packages
Single chip integration of multiple
functions - transmitter, receivers and
built-in-test
High speed digital (10 Gbps) or RF photonic
components
Ability to optically monitor Vertical Cavity
Surface Emitter Lasers (VCSEL) on a per-channel
basis
Operation over a wide temperature range and
radiation
We specialize in challenging engineering tasks:
high-speed mixed-signal circuit design, packaging for
high fidelity electrical and optical coupling, and
testing at the wafer and component level.
February 12, 2010 Ultra Communicationsawarded three Phase II SBIR awards to develop ruggedized
transceivers and related technology, including
manufacturing infrastructure. more
April 6, 2009 Ultra Communicationsawarded ten SBIR awards to develop ruggedized
transceivers and related technology. more
August 11, 2008
Ultra Communications delivers 10 Gbps VCSEL-based
transceivers to Space Customer. more
