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1000 Park Center Dr
Vista, CA, 92081
United States

(505) 823-1293

We supply photonic components for harsh environment applications.  These applications require components to operate through wide temperature ranges, shock, vibration, condensation, chemicals, and/or radiation.

Example applications are: aerospace, space, shipboard, automotive, and high-performance computing (high temperature and/or submersion cooling). 

Projects

We are very active in SBIR programs, which provide seed funding for new technology development and future products. We are continually seeking system integrator partnership and product development/sales channels for these programs.

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QFN Low-Profile Quad Transceivers - A 12.5 Gbps quad transceiver is in development in three configurations for customers.
    NASA - Space: The CORE can be outfitted with non-volatile memory for space applications, and mounted with TEC devices to reach the extreme temperature ranges needed in space exploration.
   NAVAIR - OTDR in Test Equipment: The CORE with the integrated OTDR ASIC creates an OTDR component that can be inserted within portable OTDR test equipment to provide high-resolution (1 cm) measurements on multiple fiber channels simultaneously. 
  AFRL - Stand-alone Transceiver:  The CORE with an integrated micro-controller creates a stand-alone, fully functional transceiver in a package less that 5 mm in height and operating at 12.5 Gbps per channel.

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URelSOC ASIC - This Air Force program develops a new technology to reduce the cost of characterizing the performance and lifetime of next generation Radio Frequency (RF) devices, components and sub-systems.   The key to this innovation is the integration of universal RF test equipment functionality into an  ASIC, a “Universal Reliability System-On-Chip (URelSOC)”, and a low-cost hardware solution incorporating control of DUT temperature. 

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SFP+ Transceiver with integrated OTDR - An SFP+ transceiver with 1 cm resolution OTDR can map the fiber cable plant and report the location of fiber faults (contaminated connectors, fault splices, broken fiber, connectors left open, etc.) without opening the cable plant.  There is an option to read-out digital diagnostic information (such as OTDR data maps) wirelessly, to ease the installation in legacy systems.  This is a program funded by a NAVSEA SBIR program.

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Embedded Optical Module - We are developing technology for integrating optical interconnections within high performance ASIC packaging, with Department of Energy funding.  The placement of fiber optic components within PCB, near the data-source, reduces the board level complexity and power consumption associated with the routing high speed signals over copper traces.  To achieve this integration, the component must be compatible with lead-free solder reflow temperature extremes. 

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OTDR ASIC - The FFD DIE is a high resolution Optical Time Domain Reflectometer (OTDR) ASIC. The FFD DIE provides the necessary clocking, timing/pattern generation, receiving, and sampling functions needed to implement an OTDR within a transceiver. This enables low‐cost implementation of OTDR within physical layer components. In OTDR mode, the FFD DIE generates a narrow pulse on an electrical channel in CMLformat. This pulse is converted to optical format and coupled into a fiber. The FFD has a built‐in receiver circuit that, when coupled with an external photodetector, can precisely measure the timing and amplitude of optical reflections within the fiber.  Funded by NAVAIR SBIR Phase III.

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PEM Transceiver Qual - This NAVAIR program performs harsh environment qualification on plastic encapsulated microelectronic (PEM) transceivers.  While electronic components are commonly used in avionics without hermetic can packaging, OE components are relatively unproven.   This program addresses fiber optic system affordability by 1) reducing the transceiver manufacturing costs by eliminating expensive ceramic substrates, metalized fiber and active alignment process, 2) reducing the transceiver assembly, handling and fiber-related repair costs by adding a removable fiber connector, and 3) reduce fiber cable maintenance costs by incorporating built-in-test for health monitoring of the fiber optic cable plant.

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Rugged Vertical Connector (RVCON™) - a ribbon fiber connector interface for harsh environment applications.  This connector offers efficient coupling over a wide temperature range (-120 C to +100 C) and is design with a kinematic interface.  Our approach utilizes expanded beam optical interface to give alignment tolerance at the connector interface. 
(Phase II SBIR - TPOC Brian McDermott, NAVAIR)

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Micro-Scale Transmit and Receivers (10 Gbps) - As high performance, stacked PCB systems adopt higher-data rate bus standards, such as PCI-Express, the stacked electrical connectors pose density, signal integrity and EMI issues. We are developing novel optical board-to-board and thru-board optical interconnects to solve these issues. This program developed single channel 10 Gbps components with integrated memory to store calibration data.
(Army Phase IIE SBIR— TPOC Michael Gerhold, ARL)

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RF Photonics with Multi-Mode VCSELs- We examined the use of commercial 850 nm Vertical Cavity Surface Emitting Lasers (VCSEL) and multimode optical fiber for analog RF communication applications.  We found phase noise performance better than -120 dBc/Hz in the frequency range from 100 MHz to 5 GHz (10 kHz offset).  This performance meets the needs of a wide range of RF photonic applications, offering extreme isolation, compact size, low power consumption, and flexible cabling.  See white paper or contact us for more information.
(Air Force Phase I SBIR— TPOC Lt. Matthew White, WPAFRL)

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Multi-Channel DWDM Tunable Transmitter - We teamed with West Virginia High Technology Consortium to develop a multi-channel DWDM transmitter (MCTX) with eight individual data channels, each of which can be assigned a wavelength from the nine available defined by the 1550 nm C-Band ITU Grid (32-40).  Each channel of the transmitter operates at a data rate between 2.5 Gbps.  The goal is a robust package suitable for military aerospace applications.
(Ph II SBIR— TPOC Brian McDermott, NAVAIR)

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Wafer Bonding Technology for BiCMOS on Sapphire -  A process for producing very high performance RF silicon circuitry in a manner that enables unprecedented levels of RF integration.  This program began with an investigation into a general wafer substrate substitution process for optimizing the substrate in silicon fabrication processes, called silicon-on-X (SOX), where X is a substrate material that optimizes the silicon circuitry for a target applications (high-power, thermal expansion coefficients, isolation, optical, etc.).  The near-term benefit of this technology is its application to BiCMOS RF circuitry. 
(DARPA Phase I SBIR— TPOC Michael Fritze, DARPA)