Ultra Communications was founded in 2005 as a spin-out of Peregrine Semiconductor. We are a team of engineers that developed multi-Gbps, multi-channel transceivers since the year 2000. We have talents covering all aspects of photonic component development, manufacturing and qualification.
Charlie Kuznia, Ph. D. - Chief Executive Officer & President
23 years of experience in the areas of integrated optoelectronic/VLSI systems, free-space and fiber optic interconnects.
Joe Ahadian, Ph. D. - Chief Technology Officer & Vice President Engineering
19 years of experience in the design of high-speed mixed-signal circuits, with major designs including TIAs, laser drivers, PLLs, clock-recovery circuits, VCOs, high-linearity low-noise broadband amplifiers, RF switches, and RF power amplifiers.
Richard Pommer - Chief Operations Officer & Vice President of Operations
42 years of experience managing interconnect packaging projects from initial concept into pilot production for commercial and military applications.
Richard Hagan - Chief Information Officer & Vice President of Design
34 years of experience in advanced design engineering for high reliability components, including high density interconnects, optical components and ASIC packaging. Experience in implementing quality control systems and creating qualification plans.
Chuck Tabbert - Chief of Business Development & Vice President Sales and Marketing
24 years technical and management experience spanning several Space & Defense semiconductor providers.
UltraComm maintains a 2,000 sq. ft. class 1000 clean room with ESD controls, including humidity. With an automated 8” wafer test system, and automated fiber optic module test station, UltraComm has photonic assembly & test capabilities (50 GHz scopes, 17 Gbps BERTs) on-site. UltraComm also maintains environmental test chambers, including a EPIC thermal cycle/shock camber for stressing optical modules through qualification. In 2010, we added precision flip-chip bond capability (FineTech Semi-Automatic Fineplacer Lambda Die Bonder with 0.5 micron placement accuracy).