contact us

Use the form on the right to contact us.

You can edit the text in this area, and change where the contact form on the right submits to, by entering edit mode using the modes on the bottom right.

1000 Park Center Dr
Vista, CA, 92081
United States

(505) 823-1293

We supply photonic components for harsh environment applications.  These applications require components to operate through wide temperature ranges, shock, vibration, condensation, chemicals, and/or radiation.

Example applications are: aerospace, space, shipboard, automotive, and high-performance computing (high temperature and/or submersion cooling). 


Ultra Communications has developed an innovative photonic packaging approach that combines optoelectronic devices (such as VCSELs, PINs) with transceiver ASICs and lenses using flip-chip bonding. The result is an extremely compact, low-cost, and robust component for optical communications. We have demonstrated fiber based and free space optical interconnects (board-to-board) with this technology. The arrangement enables the optical measurement of each VCSEL channel through an integrated photodetector, allowing for wide temperature range operation and built-in test functionality.

The CORE (shown below) is a sealed sub-component that can be placed into assembly to form a full transceiver.  The CORE is manufactured with passive alignment thru accurate flip-chip bonding.  The elements that make up a CORE are all wafer-scale fabricated components that are flip-chip bonded (aligned passively) offering a low cost, rugged solution.   The CORE can be inserted into a higher-level assembly to create a full transceiver.

Ultra Communications has also developed a ruggedized vertical connector (RVCON™)  that interfaces to the CORE.  This connector has up to 12 fibers in a single termini, and is compatible with multimode 50/62.5/100 micron core fiber, single mode fiber (on the receiver side), and wavelengths from 850 nm to 1650 nm.


Ultra Communications also designs custom mixed-signal ASICs in CMOS, BiCMOS (SiGe) and Silicon-on-Sapphire processes.  These ASICs have applications in RF and photonic markets.  Recently, we developed an ASIC that enables optical-time-domain-reflectometry (OTDR) functionality within fiber optic transceivers and active optical cables.  The OTDR ASIC offers 1 cm resolution with no dead-zone (see below).