Ultra Communications has developed an innovative photonic packaging approach that combines optoelectronic devices (such as VCSELs, PINs) with transceiver ASICs and lenses using flip-chip bonding. The result is an extremely compact, low-cost, and robust component for optical communications. We have demonstrated fiber based and free space optical interconnects (board-to-board) with this technology. The arrangement enables the optical measurement of each VCSEL channel through an integrated photodetector, allowing for wide temperature range operation and built-in test functionality.
The CORE (shown below) is a sealed sub-component that can be placed into assembly to form a full transceiver. The CORE is manufactured with passive alignment thru accurate flip-chip bonding. The elements that make up a CORE are all wafer-scale fabricated components that are flip-chip bonded (aligned passively) offering a low cost, rugged solution. The CORE can be inserted into a higher-level assembly to create a full transceiver.
Ultra Communications has also developed a ruggedized vertical connector (RVCON™) that interfaces to the CORE. This connector has up to 12 fibers in a single termini, and is compatible with multimode 50/62.5/100 micron core fiber, single mode fiber (on the receiver side), and wavelengths from 850 nm to 1650 nm.
Ultra Communications also designs custom mixed-signal ASICs in CMOS, BiCMOS (SiGe) and Silicon-on-Sapphire processes. These ASICs have applications in RF and photonic markets. Recently, we developed an ASIC that enables optical-time-domain-reflectometry (OTDR) functionality within fiber optic transceivers and active optical cables. The OTDR ASIC offers 1 cm resolution with no dead-zone (see below).