/ who we are
and Manufactured in
Ultra Communications designs, develops and manufactures the industry’s most compact high-speed fiber optic components for harsh environments (HEFO). The products are built on UltraComm’s patented planar flip-chip packaging platform enabling never before possible products that are the smallest in size, the lowest in weight and power (SWaP), are SMT reflow solderable and use our patented removable RVCON connector.
Embedded Optical Modules
/ OUR SERVICES
Collaborative Development of Unique Optical Solutions